Master's Thesis - Wafer Bonding and System Packaging(m/w/x)

City: Chemnitz Date: Mar 29, 2025 # Master's Thesis - Wafer Bonding and System Packaging Fraunhofer ENAS is one of the global leaders in the field of MEMS packaging at the wafer and component level. The wafer-level MEMS package must allow access to desired measurable media (e.g., liquids, gases or light) while simultaneously shielding from unwanted external influences. These bonding technologies are applied not only to passive elements but also to active elements such as micro mirrors and printheads. With regard to advancing system integration, electronic components must also be included in the microsystem. In the System Packaging department, investigations are carried out that primarily focus on wafer-level integration, in addition to hybrid integration at the chip level. For such vertical stacks, particular attention must be paid to the influences of individual bonding technologies (temperature, pressure), as well as the electrical and thermal behavior of the system. A complete cleanroom preparation line, including characterization equipment for processing 4" to 8" substrates, is available for permanent and temporary wafer-level bonding. We are looking for motivated **Master's students** to join our multidisciplinary team and contribute to cutting-edge research in the field of **wafer bonding** and **system packaging**. **What you will do** * Together, we will define a topic for your research. * You will conduct literature research, thereby building a fundamental understanding of processes in microsystem technology. * The topic may include metallization (with electrochemical deposition), innovative materials, or wafer bonding techniques such as direct, anodic, and hybrid bonding. You will develop an in-depth understanding of the subject matter. * You will independently carry out your tasks, which includes planning and conducting experiments. Finally, you will summarize your research results in a thesis. **What you bring to the table** * You are currently studying in a Master's program in Electrical Engineering, Mechanical Engineering, Materials Science, or a similar field. * You have a good knowledge of microsystem technology and, ideally, have some experience with wafer bonding or packaging technologies. * You are familiar with common MS Office applications. * Knowledge of Python programming and its application in scientific research would be advantageous. * You are characterized by an independent work style. * You are communicative and a team player. * Experience in the field of computer vision and pattern recognition would also be a plus, but it is not a mandatory requirement. **What you can expect** * You will be working in a multidisciplinary team. * Of course, we will provide you with extensive onboarding, and dedicated contacts will be available to you. * You will have the opportunity to work on exciting and innovative projects. * We offer you a highly interesting working environment. * With flexible working hours, you will have the opportunity to balance your studies and thesis work. We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Fraunhofer Institute for Electronic Nano Systems ENAS **Job Segment:** Mechanical Engineer, Electrical, Engineer, Electrical Engineering, Engineering, Research