Fraunhofer-Gesellschaft
Wissenschaftliche Mitarbeit im Bereich Interconnect Technologies(m/w/x)
Full-time/Part-timeTemporary contractWith HomeofficeExperienced
Dresden
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FRFraunhofer-Gesellschaft
Reseach Associate for Interconnect Technologies(m/w/x)
Dresden
Full-time, Part-timeWith Home OfficeExperienced
Nejo AI Summary
Integration of UPD solutions into BEOL metallization modules within 300mm cleanroom environments. Deep technical knowledge in PVD and CMP processes required. Public-sector collective wage agreement, performance-based variable remuneration.
Requirements
- Degree in microelectronics, electrical engineering, or comparable
- Professional experience or a completed doctorate
- Know-how in semiconductor manufacturing technologies
- Thin film deposition (PVD) knowledge
- Chemical mechanical polishing (CMP) knowledge
- Advanced packaging knowledge
- BEOL process integration knowledge
- Expertise working with industrial partner companies
- Experience in project management
- Knowledge of analysis and measurement methods
- Independent, proactive, and precise work approach
- Pragmatic and flexible approach to work
- Interest in working in research environments
- Strong communication skills in German and English
Tasks
- Conduct research and development in interconnect technologies
- Integrate existing UPD solutions into BEOL metallization modules
- Evaluate and develop novel metallization solutions
- Assess feasibility of complex project ideas in 300mm cleanrooms
- Implement measures for complex projects in cleanroom environments
- Develop synergies between BEOL technologies and advanced packaging
- Advance silicon interposer technologies within packaging solutions
- Supervise existing CMP processes scientifically
- Develop new solutions for CMP processes
- Manage and acquire industrially and publicly funded projects
- Exchange and present research results at scientific conferences
- Participate in professional workshops
Education
Master's degree
Languages
German – Business FluentEnglish – Business Fluent
Tools & Technologies
PVDCMPAdvanced packagingBEOL process integrationHVM equipment platforms
Benefits
Flexible Working
- •Flexible working hours
- •Mobile working option
Bonuses & Incentives
- •Performance-based variable remuneration
Informal Culture
- •Attractive international working environment
Learning & Development
- •Extensive training and qualification
Retirement Plans
- •Company pension scheme
Public Transport Subsidies
- •Job ticket for public transport
More Vacation Days
- •30 days vacation
Corporate Discounts
- •Corporate benefits
Career Advancement
- •TALENTA career development program
Find the original job posting in its most current version here. Nejo automatically captured this job from the website of Fraunhofer-Gesellschaft and processed the information on Nejo with the help of AI for you. Despite careful analysis, some information may be incomplete or inaccurate. Please always verify all details in the original posting! Content and copyrights of the original posting belong to the advertising company.
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FRFraunhofer-Gesellschaft
Reseach Associate for Interconnect Technologies(m/w/x)
Dresden
Full-time, Part-timeWith Home OfficeExperienced
Nejo AI Summary
Integration of UPD solutions into BEOL metallization modules within 300mm cleanroom environments. Deep technical knowledge in PVD and CMP processes required. Public-sector collective wage agreement, performance-based variable remuneration.
Requirements
- Degree in microelectronics, electrical engineering, or comparable
- Professional experience or a completed doctorate
- Know-how in semiconductor manufacturing technologies
- Thin film deposition (PVD) knowledge
- Chemical mechanical polishing (CMP) knowledge
- Advanced packaging knowledge
- BEOL process integration knowledge
- Expertise working with industrial partner companies
- Experience in project management
- Knowledge of analysis and measurement methods
- Independent, proactive, and precise work approach
- Pragmatic and flexible approach to work
- Interest in working in research environments
- Strong communication skills in German and English
Tasks
- Conduct research and development in interconnect technologies
- Integrate existing UPD solutions into BEOL metallization modules
- Evaluate and develop novel metallization solutions
- Assess feasibility of complex project ideas in 300mm cleanrooms
- Implement measures for complex projects in cleanroom environments
- Develop synergies between BEOL technologies and advanced packaging
- Advance silicon interposer technologies within packaging solutions
- Supervise existing CMP processes scientifically
- Develop new solutions for CMP processes
- Manage and acquire industrially and publicly funded projects
- Exchange and present research results at scientific conferences
- Participate in professional workshops
Education
Master's degree
Languages
German – Business FluentEnglish – Business Fluent
Tools & Technologies
PVDCMPAdvanced packagingBEOL process integrationHVM equipment platforms
Benefits
Flexible Working
- •Flexible working hours
- •Mobile working option
Bonuses & Incentives
- •Performance-based variable remuneration
Informal Culture
- •Attractive international working environment
Learning & Development
- •Extensive training and qualification
Retirement Plans
- •Company pension scheme
Public Transport Subsidies
- •Job ticket for public transport
More Vacation Days
- •30 days vacation
Corporate Discounts
- •Corporate benefits
Career Advancement
- •TALENTA career development program
Find the original job posting in its most current version here. Nejo automatically captured this job from the website of Fraunhofer-Gesellschaft and processed the information on Nejo with the help of AI for you. Despite careful analysis, some information may be incomplete or inaccurate. Please always verify all details in the original posting! Content and copyrights of the original posting belong to the advertising company.
About the Company
Fraunhofer-Gesellschaft
Industry
Research
Description
Das Unternehmen ist eine der führenden Organisationen für anwendungsorientierte Forschung mit 76 Instituten in Deutschland.
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