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HIHITACHI ENERGY LTD

R&D Internship in BiMOS Semiconductor Chips(m/w/x)

Lenzburg
Full-timeInternshipOn-site

Investigating next-gen Si power device concepts, performing design simulations, and electrical characterization. Understanding of device physics and fabrication processes needed. Dedicated mentorship provided.

Requirements

  • Master’s student, recent bachelor’s graduate, or similar
  • Data analysis and statistics know-how
  • Knowledge of programming or scripting languages
  • Understanding of semiconductor device physics
  • Knowledge of semiconductor materials and fabrication
  • Understanding of diodes, MOSFETs, and BJTs
  • Excellent written and verbal communication skills
  • Fluency in English
  • Official university certificate for mandatory internship

Tasks

  • Investigate next-generation Si power semiconductor device concepts
  • Analyze experimental data to improve electrical performance
  • Study safe-operating-area behavior and device failure modes
  • Perform device design work and run simulations
  • Benchmark design outcomes through detailed electrical characterization
  • Present insights and results to multidisciplinary teams
  • Support root-cause analyses for device behavior during SOA conditions
  • Collaborate with fabrication and testing teams on experiments

Education

  • Currently in higher educationOR
  • Bachelor's degree

Languages

  • EnglishBusiness Fluent

Tools & Technologies

  • Python
  • Si
  • SiC
  • GaN
  • diodes
  • MOSFETs
  • BJTs

Benefits

Flexible Working

  • Flexible working conditions

Mentorship & Coaching

  • Dedicated mentorship

Startup Environment

  • Supportive and inclusive environment
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