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Summer Internship: Human-Machine Interface (HMI) System Applications(m/w/x)
Assembling HMI demonstrators with circuit boards, cabling, and OLED/LCD displays in a lab environment. Proficiency in SMD soldering and 3D design for small fixtures required. Hands-on experience with lab instruments and 3D printing.
Anforderungen
- Good electronic prototype assembly and mechanics skills
- Knowledge of 3D design and 3D printing
- Experience in demonstrator bring-up
- Good spoken and written English skills
Aufgaben
- Assemble demonstrators including circuit boards, cabling, and OLED/LCD displays
- Test demonstrators according to specific instructions
- Support the team with 3D design for small fixtures
- Solder SMD components
- Operate lab instruments in a lab environment
- Support the team with measurement tasks
- Document test results in Confluence and Jira
Ausbildung
- Laufendes StudiumODER
- Bachelor-Abschluss
Sprachen
- Englisch – verhandlungssicher
Tools & Technologien
- 3D design
- 3D printing
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- Summer Internship: Human-Machine Interface (HMI) System ApplicationsSummer Internship: Human-Machine Interface (HMI) System A...
Noch nicht perfekt?
- AT61 NXP Semiconductors Austria GmbH & Co KGVollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat
- AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship: Automotive NFC Lab(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship: NFC RF System Validation(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship: System Validation(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship Validation(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat
- Home
- Jobs in Österreich
- Gratwein Strassengel
- Summer Internship: Human-Machine Interface (HMI) System ApplicationsSummer Internship: Human-Machine Interface (HMI) System A...
Summer Internship: Human-Machine Interface (HMI) System Applications(m/w/x)
Assembling HMI demonstrators with circuit boards, cabling, and OLED/LCD displays in a lab environment. Proficiency in SMD soldering and 3D design for small fixtures required. Hands-on experience with lab instruments and 3D printing.
Anforderungen
- Good electronic prototype assembly and mechanics skills
- Knowledge of 3D design and 3D printing
- Experience in demonstrator bring-up
- Good spoken and written English skills
Aufgaben
- Assemble demonstrators including circuit boards, cabling, and OLED/LCD displays
- Test demonstrators according to specific instructions
- Support the team with 3D design for small fixtures
- Solder SMD components
- Operate lab instruments in a lab environment
- Support the team with measurement tasks
- Document test results in Confluence and Jira
Ausbildung
- Laufendes StudiumODER
- Bachelor-Abschluss
Sprachen
- Englisch – verhandlungssicher
Tools & Technologien
- 3D design
- 3D printing
Über das Unternehmen
AT61 NXP Semiconductors Austria GmbH & Co KG
Branche
Engineering
Beschreibung
The company is focused on secure, connected IoT devices and offers the EdgeLock 2GO IoT service platform.
Noch nicht perfekt?
- AT61 NXP Semiconductors Austria GmbH & Co KG
(Summer) Internship: Testing / Active Probe Development(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship: Automotive NFC Lab(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship: NFC RF System Validation(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship: System Validation(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat - AT61 NXP Semiconductors Austria GmbH & Co KG
Summer Internship Validation(m/w/x)
VollzeitPraktikumnur vor OrtGratkornab 2.100 / Monat