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Senior IC Test Engineer(m/w/x)
Test program development for high-speed interfaces and embedded IP blocks for autonomous driving systems. 7+ years product/test engineering experience with complex chip bring-up and DFT methods required. Teradyne UltraFlex/UltraFlexPlus systems in use.
Anforderungen
- BSc or MSc degree in Electrical Engineering
- 7+ years experience as IC Product/Test engineer
- Experience in bring-up and productization of complex ICs
- Prior experience with Teradyne UltraFlex/UltraFlexPlus (advantageous)
- Deep understanding of structural DFT methods
- Proficiency in C/C++, scripting, and Unix
- Experience with data and yield analysis
- Familiarity with Verilog and RTL simulations (advantageous)
- Strong sense of ownership and commitment
- Teamwork skills in rapidly evolving environments
- Good interpersonal communication skills
Aufgaben
- Review DFX architecture with design teams
- Define test requirements during early design stages
- Develop test methodologies for high-speed interfaces
- Generate test content for embedded IP blocks
- Code test programs and convert patterns
- Perform pre-silicon validation through virtual simulations
- Support load board and probe card design
- Lead post-silicon test program debugging
- Deliver samples to internal and external customers
- Characterize and tune programs for automotive standards
- Support the Quality and Reliability team
- Execute timely qualification plans
- Lead test deployment with Foundry and OSAT vendors
- Manage large-scale Wafer-Sort and Final-Test operations
Ausbildung
- Bachelor-AbschlussODER
- Master-Abschluss
Sprachen
- Englisch – verhandlungssicher
Tools & Technologien
- Teradyne UltraFlex
- Teradyne UltraFlexPlus
- C
- C++
- Perl
- Python
- Unix
- JMP
- Verilog
- RTL behavioral simulations
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Senior IC Test Engineer(m/w/x)
Test program development for high-speed interfaces and embedded IP blocks for autonomous driving systems. 7+ years product/test engineering experience with complex chip bring-up and DFT methods required. Teradyne UltraFlex/UltraFlexPlus systems in use.
Anforderungen
- BSc or MSc degree in Electrical Engineering
- 7+ years experience as IC Product/Test engineer
- Experience in bring-up and productization of complex ICs
- Prior experience with Teradyne UltraFlex/UltraFlexPlus (advantageous)
- Deep understanding of structural DFT methods
- Proficiency in C/C++, scripting, and Unix
- Experience with data and yield analysis
- Familiarity with Verilog and RTL simulations (advantageous)
- Strong sense of ownership and commitment
- Teamwork skills in rapidly evolving environments
- Good interpersonal communication skills
Aufgaben
- Review DFX architecture with design teams
- Define test requirements during early design stages
- Develop test methodologies for high-speed interfaces
- Generate test content for embedded IP blocks
- Code test programs and convert patterns
- Perform pre-silicon validation through virtual simulations
- Support load board and probe card design
- Lead post-silicon test program debugging
- Deliver samples to internal and external customers
- Characterize and tune programs for automotive standards
- Support the Quality and Reliability team
- Execute timely qualification plans
- Lead test deployment with Foundry and OSAT vendors
- Manage large-scale Wafer-Sort and Final-Test operations
Ausbildung
- Bachelor-AbschlussODER
- Master-Abschluss
Sprachen
- Englisch – verhandlungssicher
Tools & Technologien
- Teradyne UltraFlex
- Teradyne UltraFlexPlus
- C
- C++
- Perl
- Python
- Unix
- JMP
- Verilog
- RTL behavioral simulations
Über das Unternehmen
Mobileye
Branche
Automotive
Beschreibung
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles.
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