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Test Engineer, Automotive Robotics(m/w/x)
Description
Design and test strategies for multi-die SiP platforms and RISC-V chiplet SoCs at AI hardware firm. 10+ years of cross-team coordination and ASIC production experience required. High-volume production oversight with external OSAT partners.
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Requirements
- •Experience with ASIC design and production
- •Ability to translate system requirements
- •Confidence working with external vendors
- •Comfort in cross-functional DFT roles
- •10+ years of cross-team coordination
- •Eligibility for U.S. export-controlled technology
Education
Work Experience
10 years
Tasks
- •Design and deliver core hardware modules for next-generation automotive chiplet SoCs
- •Bridge silicon design, DFT, OSAT partners, and customers
- •Ensure multi-die SiP platforms meet performance, quality, and safety targets
- •Define test strategies for multi-chiplet packages from initial silicon to high-volume production
- •Integrate lessons learned into next-generation SiP architectures and DFT strategies
- •Optimize test content based on previous production cycles
- •Manage the transition of SiP modules to high-volume automotive-grade production
- •Unify chiplets, RISC-V CPUs, AI accelerators, and die-to-die links into automotive platforms
- •Balance package architecture and DFT against test costs
- •Meet aggressive performance, quality, and reliability targets through strategic trade-offs
Tools & Technologies
Languages
English – Business Fluent
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Test Engineer, Automotive Robotics(m/w/x)
The AI Job Search Engine
Description
Design and test strategies for multi-die SiP platforms and RISC-V chiplet SoCs at AI hardware firm. 10+ years of cross-team coordination and ASIC production experience required. High-volume production oversight with external OSAT partners.
Let AI find the perfect jobs for you!
Upload your CV and Nejo AI will find matching job offers for you.
Requirements
- •Experience with ASIC design and production
- •Ability to translate system requirements
- •Confidence working with external vendors
- •Comfort in cross-functional DFT roles
- •10+ years of cross-team coordination
- •Eligibility for U.S. export-controlled technology
Education
Work Experience
10 years
Tasks
- •Design and deliver core hardware modules for next-generation automotive chiplet SoCs
- •Bridge silicon design, DFT, OSAT partners, and customers
- •Ensure multi-die SiP platforms meet performance, quality, and safety targets
- •Define test strategies for multi-chiplet packages from initial silicon to high-volume production
- •Integrate lessons learned into next-generation SiP architectures and DFT strategies
- •Optimize test content based on previous production cycles
- •Manage the transition of SiP modules to high-volume automotive-grade production
- •Unify chiplets, RISC-V CPUs, AI accelerators, and die-to-die links into automotive platforms
- •Balance package architecture and DFT against test costs
- •Meet aggressive performance, quality, and reliability targets through strategic trade-offs
Tools & Technologies
Languages
English – Business Fluent
About the Company
Tenstorrent
Industry
IT
Description
Tenstorrent leads in AI technology, revolutionizing performance, ease of use, and cost efficiency with its RISC-V CPU.
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