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MIMicrochip Technology Inc.

Technician I-Production(m/w/x)

Teltow
Full-timeOn-site

Precision assembly of microelectronic components via wire, die, and flip chip bonding for critical technology applications. Fine motoric hand work under microscope required. Production environment for high-impact technology.

Requirements

  • Technical training, technician or higher qualification
  • Understanding of technical relationships
  • Fine motoric hand work under microscope
  • Knowledge of Microsoft Office
  • Good technical and electronic understanding
  • Interdepartmental teamwork
  • High reliability
  • Good German language skills

Tasks

  • Perform wire-bonding
  • Execute die-bonding
  • Conduct finetuning
  • Place lids accurately
  • Implement flip chip bonding
  • Follow work instructions and inspection requirements
  • Collaborate with other departments to enhance productivity

Education

  • Vocational certification

Languages

  • GermanBusiness Fluent

Tools & Technologies

  • Microsoft Office
Find the original job posting in its most current version here. Nejo automatically captured this job from the website of Microchip Technology Inc. and processed the information on Nejo with the help of AI for you. Despite careful analysis, some information may be incomplete or inaccurate. Please always verify all details in the original posting! Content and copyrights of the original posting belong to the advertising company.

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