Description

In this role, you will engage in cutting-edge research and development of RF circuits for wireless communication in chiplets. Your work will involve designing high-speed interfaces, characterizing components, and collaborating with experts to drive innovation in the field.

Requirements

• •Doctoral's or Master's Degree in Electrical Engineering or communication engineering
• •3+ years’ expertise in RF and analogue integrated circuit design
• •3+ years’ experience in 2.5/3D electromagnetic simulations of mmWave components and structures
• •Advanced professional experience in RF measurement techniques
• •Expertise in Cadence Virtuoso, Cadence EMX Designer, Ansys HFSS and CST Studio Suite
• •High motivation and ability to quickly familiarize with new challenges
• •Enjoyment of working in a team to achieve high-quality results
• •Independent and structured working style with strong problem-solving skills
• •Very good communication skills in German and English

Tasks

• •Develop integrated RF circuits and systems for mmWave and sub-THz wireless communication interfaces in chiplets
• •Design high-speed control circuits and interfaces for embedding wireless communication into complex systems
• •Create passive RF components and 3D structures for heterogeneous integration of wireless communication interfaces
• •Characterize RF circuits and passive structures using advanced RF measurement equipment
• •Collaborate with internal technology departments and external partners on high-level research projects
• •Provide technical expertise to support business activities with industry customers
• •Present project results at international conferences and to project partners

Tools & Technologies

Benefits