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Photonics Engineer for PIC testing and packaging(m/w/x)
Description
In this leadership role, you will guide a dedicated team to master the unique challenges of packaging photonic integrated circuits for extreme cryogenic environments and quantum applications.
Let AI find the perfect jobs for you!
Upload your CV and Nejo AI will find matching job offers for you.
Requirements
- •Master’s degree, PhD in Engineering, Physics, Photonics, or related field
- •Professional experience in photonic packaging industry
- •Deep understanding of PIC Packaging
- •Experience with cryogenic or harsh environment packaging highly desired
- •Knowledge of thermal management and material properties
- •Familiarity with PIC design principles
- •Experience leading small teams or projects
- •Hands-on leadership and strategic planning skills
Education
Work Experience
2 - 5 years
Tasks
- •Lead and mentor a packaging team
- •Plan workflows and ensure project execution
- •Develop high-precision fiber-to-chip coupling strategies
- •Maximize coupling efficiency at cryogenic temperatures
- •Oversee chip attachment and wire bonding
- •Ensure reliability under extreme thermal cycling
- •Design submounts and packaging interfaces
- •Calculate and mitigate mechanical CTE stress
- •Automate manual packaging processes
- •Collaborate with the PIC design team
- •Optimize Mode Size Converters and spot sizes
- •Select and qualify cryogenic-grade materials
Tools & Technologies
Languages
English – Business Fluent
Benefits
Competitive Pay
- •Competitive salary and compensation
Informal Culture
- •Team-centric workplace
- •Flat hierarchies
- •Open communication
- •Open-door policy
- •Diverse and multi-national environment
Flexible Working
- •Remote work options
Family Support
- •Family-friendly environment
Purpose-Driven Work
- •Significant responsibility from day one
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Photonics Engineer for PIC testing and packaging(m/w/x)
The AI Job Search Engine
Description
In this leadership role, you will guide a dedicated team to master the unique challenges of packaging photonic integrated circuits for extreme cryogenic environments and quantum applications.
Let AI find the perfect jobs for you!
Upload your CV and Nejo AI will find matching job offers for you.
Requirements
- •Master’s degree, PhD in Engineering, Physics, Photonics, or related field
- •Professional experience in photonic packaging industry
- •Deep understanding of PIC Packaging
- •Experience with cryogenic or harsh environment packaging highly desired
- •Knowledge of thermal management and material properties
- •Familiarity with PIC design principles
- •Experience leading small teams or projects
- •Hands-on leadership and strategic planning skills
Education
Work Experience
2 - 5 years
Tasks
- •Lead and mentor a packaging team
- •Plan workflows and ensure project execution
- •Develop high-precision fiber-to-chip coupling strategies
- •Maximize coupling efficiency at cryogenic temperatures
- •Oversee chip attachment and wire bonding
- •Ensure reliability under extreme thermal cycling
- •Design submounts and packaging interfaces
- •Calculate and mitigate mechanical CTE stress
- •Automate manual packaging processes
- •Collaborate with the PIC design team
- •Optimize Mode Size Converters and spot sizes
- •Select and qualify cryogenic-grade materials
Tools & Technologies
Languages
English – Business Fluent
Benefits
Competitive Pay
- •Competitive salary and compensation
Informal Culture
- •Team-centric workplace
- •Flat hierarchies
- •Open communication
- •Open-door policy
- •Diverse and multi-national environment
Flexible Working
- •Remote work options
Family Support
- •Family-friendly environment
Purpose-Driven Work
- •Significant responsibility from day one
About the Company
Pixel Photonics
Industry
Science
Description
The company develops sensors and detector solutions for sensing faint light signals, essential for quantum technologies.
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