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BOBosch Group

Master Thesis Simulation Laser Processing of Semiconductor Materials(m/w/x)

Renningen
Full-timeInternshipOn-site

Developing SiC material models for thermomechanical FEM simulations of laser processing at global technology supplier. FEM simulation and material modeling experience essential, thermomechanical simulation experience preferred. Focus on predicting crack formation in semiconductor materials.

Requirements

  • Master studies in Mechanical Engineering, Materials Science, Physics, or comparable
  • Simulation experience with FEM simulation and material modeling
  • Prior experience with thermomechanical or thermal joining simulations
  • Experience or coursework in semiconductor materials (e.g., Silicon, Silicon Carbide) (advantage)
  • Proactiveness and structured approach
  • Strong analytical mindset
  • Ability to work independently

Tasks

  • Develop a comprehensive SiC material model for thermomechanical simulation
  • Set up thermomechanical FEM simulations for laser processing
  • Run thermomechanical FEM simulations
  • Implement heat source and material properties
  • Predict temperature fields, residual stresses, and crack formation
  • Define, conduct, and analyze validation experiments
  • Generate reference data, including residual stress measurements
  • Compare and validate simulation results against experimental data
  • Refine the material model

Education

  • Currently in higher education

Languages

  • GermanBusiness Fluent
  • EnglishBusiness Fluent

Tools & Technologies

  • FEM simulation
  • Silicon (Si)
  • Silicon Carbide (SiC)
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