Huawei Research Center Germany & Austria
Strategic Technology Lead – AI Processors & Accelerators(m/w/x)
Full-timeOn-siteSenior
München
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HUHuawei Research Center Germany & Austria
Strategic Technology Lead – Advanced 3DIC Packaging & Integration (Mobile/STCO)(m/w/x)
München
Full-timeOn-siteSenior
AI/ML
Nejo AI Summary
Shaping future technology roadmaps for advanced semiconductor integration in mobile and AI computing. PhD and expertise in advanced heterogeneous chip design required. Healthy meals, German language courses.
Requirements
- PhD in relevant field
- Substantial industry experience
- Technical expertise in STCO for highly heterogeneous 3DIC in specific application segments (computing/AI, mobile device, etc.)
- Technical expertise in design and optimization of 3DIC on architecture level (processor or SoC)
- Technical expertise in physical design of 3DIC
- Technical expertise in advanced packaging for 3DIC
- Technical expertise in power integrity and signal integrity in 3DIC
- Strong analytical mindset
- Capability to tackle high-level strategic challenges
- Capability to tackle deep technical details
- Self-driven learning
- Staying ahead of emerging technology trends
- Exceptional communication skills
- Exceptional persuasion skills
- Ability to thrive in ambiguous, fast-paced environments
- Project leadership
- Ability to steer cross-functional teams
- Collaborative approach
- Effective work with diverse engineering teams
- Fostering knowledge sharing
- Providing clear updates to stakeholders
- Willingness to travel (occasional trips within Europe and internationally for conferences and partner engagements)
- Relationship-building skills
- Cultivating strong partnerships with stakeholders
- Fluency in English (written & spoken)
- Proficiency in PowerPoint
- Proficiency in Excel
- Ability to distill complex concepts into clear, impactful presentations
Tasks
- Evaluate emerging technologies and commercial potential through research
- Create high-impact technology reports for leadership
- Conduct early-stage feasibility studies
- Perform simulations to shape technical roadmaps
- Define and drive corporate innovation programs
- Align programs with long-term objectives
- Manage international network and external partnerships
- Collaborate with researchers, suppliers, and ecosystem partners
- Foster innovation through external collaboration
- Influence product development strategies
- Work with cross-functional teams
- Support prototyping for preliminary technical assessments
- Organize and facilitate internal seminars and workshops
- Maintain active technical exchanges with partners
Work Experience
- approx. 4 - 6 years
Education
- Doctoral / PhD
Languages
- English – Business Fluent
Tools & Technologies
- 3DIC
- PowerPoint
- Excel
Benefits
Free or Subsidized Food
- Healthy meals
Learning & Development
- Training opportunities
- Online training programs
- Face-to-face training programs
- German language courses
- Mandarin language courses
Find the original job posting in its most current version here. Nejo automatically captured this job from the website of Huawei Research Center Germany & Austria and processed the information on Nejo with the help of AI for you. Despite careful analysis, some information may be incomplete or inaccurate. Please always verify all details in the original posting! Content and copyrights of the original posting belong to the advertising company.
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HUHuawei Research Center Germany & Austria
Strategic Technology Lead – Advanced 3DIC Packaging & Integration (Mobile/STCO)(m/w/x)
München
Full-timeOn-siteSenior
AI/ML
Nejo AI Summary
Shaping future technology roadmaps for advanced semiconductor integration in mobile and AI computing. PhD and expertise in advanced heterogeneous chip design required. Healthy meals, German language courses.
Requirements
- PhD in relevant field
- Substantial industry experience
- Technical expertise in STCO for highly heterogeneous 3DIC in specific application segments (computing/AI, mobile device, etc.)
- Technical expertise in design and optimization of 3DIC on architecture level (processor or SoC)
- Technical expertise in physical design of 3DIC
- Technical expertise in advanced packaging for 3DIC
- Technical expertise in power integrity and signal integrity in 3DIC
- Strong analytical mindset
- Capability to tackle high-level strategic challenges
- Capability to tackle deep technical details
- Self-driven learning
- Staying ahead of emerging technology trends
- Exceptional communication skills
- Exceptional persuasion skills
- Ability to thrive in ambiguous, fast-paced environments
- Project leadership
- Ability to steer cross-functional teams
- Collaborative approach
- Effective work with diverse engineering teams
- Fostering knowledge sharing
- Providing clear updates to stakeholders
- Willingness to travel (occasional trips within Europe and internationally for conferences and partner engagements)
- Relationship-building skills
- Cultivating strong partnerships with stakeholders
- Fluency in English (written & spoken)
- Proficiency in PowerPoint
- Proficiency in Excel
- Ability to distill complex concepts into clear, impactful presentations
Tasks
- Evaluate emerging technologies and commercial potential through research
- Create high-impact technology reports for leadership
- Conduct early-stage feasibility studies
- Perform simulations to shape technical roadmaps
- Define and drive corporate innovation programs
- Align programs with long-term objectives
- Manage international network and external partnerships
- Collaborate with researchers, suppliers, and ecosystem partners
- Foster innovation through external collaboration
- Influence product development strategies
- Work with cross-functional teams
- Support prototyping for preliminary technical assessments
- Organize and facilitate internal seminars and workshops
- Maintain active technical exchanges with partners
Work Experience
- approx. 4 - 6 years
Education
- Doctoral / PhD
Languages
- English – Business Fluent
Tools & Technologies
- 3DIC
- PowerPoint
- Excel
Benefits
Free or Subsidized Food
- Healthy meals
Learning & Development
- Training opportunities
- Online training programs
- Face-to-face training programs
- German language courses
- Mandarin language courses
Find the original job posting in its most current version here. Nejo automatically captured this job from the website of Huawei Research Center Germany & Austria and processed the information on Nejo with the help of AI for you. Despite careful analysis, some information may be incomplete or inaccurate. Please always verify all details in the original posting! Content and copyrights of the original posting belong to the advertising company.
About the Company
Huawei Research Center Germany & Austria
Industry
IT
Description
Huawei is a leading global information and communications technology (ICT) solutions provider, committed to developing the future information society.
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