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HIHITACHI ENERGY LTD

Product Engineer – Power Semiconductors Module Packaging (BiMOS)(m/w/x)

Lenzburg
Full-timeOn-siteExperienced

Product ownership for BiMOS power semiconductor modules post R&D handover. Six Sigma and Lean project leadership experience required. Flexible working practices, international matrix organization.

Requirements

  • Master’s or PhD in Physics, Electrical Engineering, or related discipline
  • Strong expertise in statistical analysis, problem solving, and advanced data analysis
  • Semiconductor manufacturing experience (advantageous)
  • Proven experience leading complex improvement projects, ideally with small, cross-functional teams
  • Comfortable in international, matrix organization with excellent communication and collaboration skills
  • Innovative, quality-driven team player with high willingness to learn and take ownership
  • Very good command of German (B2/C1 level)
  • Very good command of English (B2/C1 level)

Tasks

  • Monitor and analyze yield and quality data
  • Identify and drive sustainable cost, quality, and yield improvements
  • Lead and execute improvement projects using Six Sigma, Lean, and 8D
  • Take full product ownership post R&D handover
  • Coordinate and monitor new product ramp up in fabrication
  • Perform root cause analysis and troubleshoot product defects
  • Derive conclusions on process and design gaps
  • Maintain and enhance data acquisition and analytics methods
  • Implement reporting methods for data-driven decision making
  • Support process and R&D engineers with technical expertise
  • Apply structured problem-solving approaches

Work Experience

  • approx. 1 - 4 years

Education

  • Master's degree

Languages

  • GermanBusiness Fluent
  • EnglishBusiness Fluent

Benefits

Flexible Working

  • Flexible working practices
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