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Q.Q.ANT

(Senior) PIC Design Engineer - Architecture & Fiber Coupling(m/w/x)

Stuttgart
Full-timeWith Home OfficeExperienced

Designing and optimizing fiber-to-chip coupling for photonic processing systems. 3+ years of PIC design, layout, and simulation tool experience required. Max. 1 day remote work, direct leadership access.

Requirements

  • Master’s degree or PhD in Photonics, Electrical Engineering, Applied Physics, or related field; equivalent industry experience considered
  • 3+ years of proven hands-on experience in photonic design, layout, and tape-out coordination
  • In-depth expertise in fiber-to-chip coupling interfaces
  • Advanced proficiency in photonic simulation tools (e.g., Lumerical/Ansys, RSoft, Photon Design Suite, or equivalent)
  • Solid practical experience with PIC-specific layout tool (e.g., Nazca, GDSFactory, or Luceda)
  • Advanced Python skills for photonic design workflows
  • Solid grounding in optical device characterization techniques
  • Interpretation of optical/electrical test data
  • Proven ability to coordinate cross-functional technical investigations
  • Strong communication skills at technical and executive level
  • Proven track record collecting and consolidating specifications from stakeholders
  • Translating specifications into circuit definitions
  • Fluent English
  • First experimental experience with TFLN / LNOI
  • Understanding of AI or high-speed optical communication system requirements for PICs
  • Knowledge of mixed-signal and photonic/electronic co-packaging challenges
  • Experience with foundry collaboration
  • Experience with process transfer to external manufacturing partners

Tasks

  • Drive design and development of advanced PIC components
  • Optimize fiber-to-chip coupling and photonic packaging
  • Lead innovation across the photonic integration lifecycle
  • Define design methodologies for PIC components
  • Coordinate cross-functional teams from concept to production
  • Develop state-of-the-art fiber-to-chip coupling solutions
  • Optimize mode matching and loss budget in packaging
  • Design, prototype, and validate specific photonic chip components
  • Ensure deliverables meet performance and schedule targets
  • Implement photonic computing architectures on chip
  • Propose novel components and integration strategies
  • Contribute to Q.ANT’s product and technology roadmap
  • Coordinate cross-disciplinary engineering projects
  • Work closely with packaging, test, and foundry teams
  • Collect and consolidate specifications from stakeholders
  • Translate stakeholder requirements into circuit definitions
  • Mentor junior engineers and technicians
  • Provide technical guidance and ensure effective collaboration
  • Present technical findings and design decisions clearly

Work Experience

  • 3 years

Education

  • Master's degree

Languages

  • EnglishFluent
  • Germanis a plus

Tools & Technologies

  • Photonics
  • Electrical Engineering
  • Applied Physics
  • Lumerical
  • Ansys
  • RSoft
  • Photon Design Suite
  • Python
  • Nazca
  • GDSFactory
  • Luceda
  • TFLN
  • LNOI
  • AI
  • high-speed optical communication system

Benefits

Flexible Working

  • Max. 1 day remote work per week

Startup Environment

  • Direct access to leadership

Informal Culture

  • Collaborative culture
Find the original job posting in its most current version here. Nejo automatically captured this job from the website of Q.ANT and processed the information on Nejo with the help of AI for you. Despite careful analysis, some information may be incomplete or inaccurate. Please always verify all details in the original posting! Content and copyrights of the original posting belong to the advertising company.

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