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Test Engineer, Automotive Robotics(m/w/x)
Design and test strategies for multi-die SiP platforms and RISC-V chiplet SoCs at AI hardware firm. 10+ years of cross-team coordination and ASIC production experience required. High-volume production oversight with external OSAT partners.
Requirements
- Experience with ASIC design and production
- Ability to translate system requirements
- Confidence working with external vendors
- Comfort in cross-functional DFT roles
- 10+ years of cross-team coordination
- Eligibility for U.S. export-controlled technology
Tasks
- Design and deliver core hardware modules for next-generation automotive chiplet SoCs
- Bridge silicon design, DFT, OSAT partners, and customers
- Ensure multi-die SiP platforms meet performance, quality, and safety targets
- Define test strategies for multi-chiplet packages from initial silicon to high-volume production
- Integrate lessons learned into next-generation SiP architectures and DFT strategies
- Optimize test content based on previous production cycles
- Manage the transition of SiP modules to high-volume automotive-grade production
- Unify chiplets, RISC-V CPUs, AI accelerators, and die-to-die links into automotive platforms
- Balance package architecture and DFT against test costs
- Meet aggressive performance, quality, and reliability targets through strategic trade-offs
Work Experience
- 10 years
Education
- Master's degree
Languages
- English – Business Fluent
Tools & Technologies
- ASIC
- DFT
- ATE
- SLT
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Test Engineer, Automotive Robotics(m/w/x)
Design and test strategies for multi-die SiP platforms and RISC-V chiplet SoCs at AI hardware firm. 10+ years of cross-team coordination and ASIC production experience required. High-volume production oversight with external OSAT partners.
Requirements
- Experience with ASIC design and production
- Ability to translate system requirements
- Confidence working with external vendors
- Comfort in cross-functional DFT roles
- 10+ years of cross-team coordination
- Eligibility for U.S. export-controlled technology
Tasks
- Design and deliver core hardware modules for next-generation automotive chiplet SoCs
- Bridge silicon design, DFT, OSAT partners, and customers
- Ensure multi-die SiP platforms meet performance, quality, and safety targets
- Define test strategies for multi-chiplet packages from initial silicon to high-volume production
- Integrate lessons learned into next-generation SiP architectures and DFT strategies
- Optimize test content based on previous production cycles
- Manage the transition of SiP modules to high-volume automotive-grade production
- Unify chiplets, RISC-V CPUs, AI accelerators, and die-to-die links into automotive platforms
- Balance package architecture and DFT against test costs
- Meet aggressive performance, quality, and reliability targets through strategic trade-offs
Work Experience
- 10 years
Education
- Master's degree
Languages
- English – Business Fluent
Tools & Technologies
- ASIC
- DFT
- ATE
- SLT
Like this job?
BetaYour Career Agent finds similar jobs for you every day.
About the Company
Tenstorrent
Industry
IT
Description
Tenstorrent leads in AI technology, revolutionizing performance, ease of use, and cost efficiency with its RISC-V CPU.
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