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Production Process Engineer - IC Substrates(m/w/x)
Process development and optimization for high-end IC substrates in lithography, mechanical, and plating areas. Process engineering experience in semiconductor packaging or electronics manufacturing required. International travel expected.
Anforderungen
- Technical degree (Bachelor or Master) in Material Science, Mechanical Engineering, Chemistry, or similar
- Experience in process engineering, ideally in IC substrate, packaging, or electronics manufacturing
- Knowledge of project management, data analytics, and statistical methods (SPC, DOE, FMEA, Six Sigma)
- Proficiency in MS Office, SAP, Minitab, or JMP
- Fluency in English (German is a plus), strong intercultural teamwork skills, and willingness to travel
- Analytical mindset, problem-solving skills, and resilience
Aufgaben
- Develop and optimize manufacturing processes in lithography, mechanical, plating, and backend areas
- Specify and qualify new equipment and tooling, including evaluating suppliers
- Ensure process stability through statistical process control (SPC)
- Troubleshoot and resolve process-related issues in daily operations
- Support new product introduction and technology ramp-up
- Conduct FMEA and DOE to enhance process performance, yield, and cost efficiency
- Implement lean methods for stable, high-yield, and cost-effective processes
- Lead task forces and continuous improvement initiatives
- Create and maintain process documentation according to AT&S standards
- Collaborate with cross-functional teams for successful product development
- Mentor and train junior engineers and technicians
- Ensure compliance with EHS, quality, and sustainability guidelines
Berufserfahrung
- ca. 1 - 4 Jahre
Ausbildung
- Bachelor-Abschluss
Sprachen
- Englisch – verhandlungssicher
- Deutsch – Grundkenntnisse
Tools & Technologien
- MS Office
- SAP
- Minitab
- JMP
Benefits
Weiterbildungsangebote
- Structured onboarding program
- Continual training opportunities
Gratis oder Vergünstigte Mahlzeiten
- Modern company canteen
Parkplatz & Pendelvorteile
- Free parking spaces
- E-charging stations
Gesundheits- & Fitnessangebote
- Diverse health measures
Sonstige Vorteile
- Wide range of employee benefits
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Production Process Engineer - IC Substrates(m/w/x)
Process development and optimization for high-end IC substrates in lithography, mechanical, and plating areas. Process engineering experience in semiconductor packaging or electronics manufacturing required. International travel expected.
Anforderungen
- Technical degree (Bachelor or Master) in Material Science, Mechanical Engineering, Chemistry, or similar
- Experience in process engineering, ideally in IC substrate, packaging, or electronics manufacturing
- Knowledge of project management, data analytics, and statistical methods (SPC, DOE, FMEA, Six Sigma)
- Proficiency in MS Office, SAP, Minitab, or JMP
- Fluency in English (German is a plus), strong intercultural teamwork skills, and willingness to travel
- Analytical mindset, problem-solving skills, and resilience
Aufgaben
- Develop and optimize manufacturing processes in lithography, mechanical, plating, and backend areas
- Specify and qualify new equipment and tooling, including evaluating suppliers
- Ensure process stability through statistical process control (SPC)
- Troubleshoot and resolve process-related issues in daily operations
- Support new product introduction and technology ramp-up
- Conduct FMEA and DOE to enhance process performance, yield, and cost efficiency
- Implement lean methods for stable, high-yield, and cost-effective processes
- Lead task forces and continuous improvement initiatives
- Create and maintain process documentation according to AT&S standards
- Collaborate with cross-functional teams for successful product development
- Mentor and train junior engineers and technicians
- Ensure compliance with EHS, quality, and sustainability guidelines
Berufserfahrung
- ca. 1 - 4 Jahre
Ausbildung
- Bachelor-Abschluss
Sprachen
- Englisch – verhandlungssicher
- Deutsch – Grundkenntnisse
Tools & Technologien
- MS Office
- SAP
- Minitab
- JMP
Benefits
Weiterbildungsangebote
- Structured onboarding program
- Continual training opportunities
Gratis oder Vergünstigte Mahlzeiten
- Modern company canteen
Parkplatz & Pendelvorteile
- Free parking spaces
- E-charging stations
Gesundheits- & Fitnessangebote
- Diverse health measures
Sonstige Vorteile
- Wide range of employee benefits
Über das Unternehmen
AT&S
Branche
Manufacturing
Beschreibung
The company is a leading global manufacturer of high-end IC substrates and printed circuit boards.
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